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Anti-counterfeiting IC detector
Test components for unique electrical characteristics
Comparison with known good products
The components against suspect components
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Bond strength/shear strength tester
Measure bond strength and sectional condition
Verify that the bond strength is up to standard
Test the integrity of the adhesive chip or the material covering the surface of the chip
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Luxo microscope /Meiji microscope
High power microscope;400 x times larger
The phenomena of packaging coating, polishing, oxidation and tin plating were detected
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